Job Openings

Job Title : Dry Etch Process Engineer

Experience : Minimum Industry Experience:: 5-10 yrs

• Required to have minimum 10 years relevant experience in semiconductor wafer fabrication plants with deep understanding of Dry Etch tools and wafer fabrication processes. Ph.D. candidate with 5-year experience will be considered
• Expertise with Dry Etch tool sets: AMAT Etchers (DPS Poly, DPS Metal, Super-E for Oxide, Metal & Poly etch processes), TEL (oxide etchers) and Gasonic tool sets
• Provide support to customer engineers working on dry etch process development/improvement to demonstrate process/product improved performance, as well as improvements to existing products and processes
• Operate relevant metrology tools to qualify process equipment and optimize processes, as well as improvements to existing products and processes for Etch process development
• Support in installation, qualification and training of new Etch tools & upgrades to current tool sets.
• Work with engineers to develop recommendations and prepare changes to tools and processes which will facilitate cost reduction, throughput increase, yield improvement activities
• Sustain dry etch processes & support lot disposition: minimize HOLD lot turnaround, improve wafer yield, own SPC for all dry etch processes, reduce OOCs and maintain recipe control
• Provide Dry Etch solutions for process integration challenges & module improvements in cross-functional team environment: to improve ET parameters, SORT yield and inline yield

In addition to the above Dry etch experience the candidate needs to have general fab experience which includes

Job Title : Real Time Defect Analysis/ Yield Defect Density Engineer

Experience : **ONLY CANDIDATES WITH INTERNATIONAL FAB EXPERIENCE WILL BE CONSIDERED**

• Required to have minimum 5 years relevant experience in semiconductor wafer fabrication plants with deep understanding of CMOS wafer fabrication processes
• Respond to situations where first-line product support has failed to isolate or fix problems in malfunctioning equipment. Reports design, reliability and maintenance problems or bugs to design engineering
• Operate metrology tools to qualify process equipment and optimize processes, as well as improvements to existing products and processes
• Create and optimize the recipes on KLA Surf scan/SP1, Patterned wafers inspection tools like KLA 2139 and SEM review tools like AMAT SEM vision
• Working with engineers to develop recommendations and prepare changes, additions, and modifications, which will improve the fabrication process and yield
• Sustain defect density monitors: minimize HOLD lot turnaround, improve wafer yield, identify the yield deterrents Lead and drive multifunctional teams for driving improvement in process
• Clearly set goals and expectations for specific teams/groups/ owners to encourage specific actions in timely manner
• exceptions and provide alerts when problems occur, communicate progress and success, and provide a common interface for inter-department works and collaboration for solving issues related to yield
• Automate and sustain yield report, covering critical yield matrixes and correlation of top bin failures for main/critical products with inline defect performances for the devices
• Enhance/develop/improve critical trend monitoring (possibly using JMP journal/scripts to add tool/chamber level connect in the future) and use these inline trends to better predict the yield performance
Support additional analysis needs (systematic and automated ways), including Hi-Lo Yield concepts to inline controls. This work will enhance current yield modelling and prediction capability
Prepare technical brief for MDs and directors, as needed
In addition to the above experience the candidate needs to have general fab experience which includes
Intimate knowledge and experience with semiconductor wafer fabrication processes
Analysis of process deviations and troubleshooting in Production and implement the learning's for Yield improvement activities.
Process characterization and optimization using DOE methodology.
DOE knowledge - Ability to design experiments that meet Design of Experiments standards.
Ability to work effectively with customers & suppliers
Good customer interface and communication skills
Strong fundamental engineering knowledge and the ability to apply it
Good process troubleshooting skills, in coordination with Integration, Device, equipment team.
Ability to learn quickly, in both process and module
Experience or training in statistical process control (SPC) and related tools, software
The ability to work independently and in groups to resolve equipment, process and integration related problems
A detailed understanding of semiconductor physics, applied chemistry, and processing requirements.
Knowledge of FEOL & BEOL process & integration is desirable
Having Knowledge of integration & device skill will be added advantage.
Excellent written and oral communication skills
Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed A willingness and ability to accept responsibility for project completion, project delegation and follow-up.
Innovative problem-solving skills and Strong multi-tasking skills
Ability to train others, ability to establish standard work-flow and operating instruction is highly preferred
Reliable candidate with integrity work ethic and data driven-decision making is preferred
Education : (UG - B.Tech/B.E. - Any Specialization) AND (PG- Any Postgraduate - Any Specialization, M.Tech - Any Specialization, Chemical, Electrical, Electronics/Telecommunication, Mechanical) AND (Doctorate- Any Doctorate - Any Specialization, Doctorate Not Required)
As a Process Engineer, the candidate will support Fab operations by monitoring Semiconductor equipment and processes for both 200mm/300mm fabs.
Candidate will understand, analyze, Improve, and fix process issues that customer reports.
In addition, you will support the customer with testing, experimentation, and overall process development and improvement.
Candidate need to collect, document, and analyze data from testing, experiments, or projects conducted in fab, as well as monitor, analyze, and address SPC issues for the process on a daily basis.
Candidate must be a motivated team player with good work ethic and time-management skills. Along with having ability to learn quickly, you are also expected to train other engineers. It is also essential you have the ability to work with minimal supervision and have strong communication and analytical problem-solving skills.
Candidate must have the ability to keep fellow engineers motivated to work and complete the tasks in time.
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Job Title : ELCTRONICS_DESIGN_ENGINEER

Experience : Minimum Industry Experience: 2 to 6 years

• Design and develop hardware, includes optimizing designs for manufacturability and cost efficiency
• Capable to work on high power design
• Will need to work in the multi-disciplinary team comprising electrical, software, system and process engineering
• Previous exp. in designing Power boxes/ Electrical Modules
• Rapidly generate design concepts that will develop into detail drawings to manufacture those concepts
• Perform Failure Modes and Effects Analysis, Organize, participate and lead design reviews.
• Familiar with PCB applications for control panel design and must have basic understanding PCB design and component selection
• Selection of OEM Components and materials for power distribution box/ control panel design..
• Work on EE CAD tools like circuit design/ simulation

*Mandatory Skills:

• Able to design circuits with consideration of EMI and EMC standards
• Detailed understanding of relevant design standards and compliances like NFC, NFPA, UL508, IEC standard, SEMI standard (Electrical)- exp. with UL Standards
• Exp. with ERP and PLM (SAP/Team Center or similar systems

Job Title : CNC Operator

Experience : Greater than 8 years

• A computer numerically controlled operator holds a highly specialised position found principally in production companies. They handle computer programmed machinery that perform a wide variety of functions such as drilling, cutting or shaping materials

• Assessing suitability of material : Inspecting material and preparing for machining Knowledge of feature control frame, control symbols, and geometric tolerancing categories, characteristics and zone shapes ; Ability to cut blanks based on bar stock sizes. Knowledge of standard steel classification and numbering system

• Planning machining taskspan Preparing job for running machining process Knowledge of machine selection and configuration, operation sequ encing, and workholding concepts and devices

• Operating CNC machine Operating CNC machine to machine a precision part to the technical and QC specification Knowledge of machine controls and ability to deburr, fixture offset adjustment, geometry offset a djustment, setup and shutdown a machine, load parts, offset tool heights and adjust work shifts. Skills of drilling, facing, peripheral and pocket milling, reaming and tapping, etc

• Measuring of tools and material Measurement of tools, material and workpieces using combination of suitable techniques and measurement instruments Knowledge of feature control frame, geometric control symbols and geometric tolerancing categories, characteristics; Ability to read micrometers, steel rule and Vernier scales. Prope r use of callipers , dial indicators, drop indicators, micrometers and steel rulers

Performing benchwork Perform Benchwork required at various stages of the CNC machining process. Ability to hack saw, to ream by hand Understanding thread classes and percentages, hand and power tapping

Applying corrective strategies during machining process Perform the material, part and machine related troubleshooting throughout the machining process to minimise risk of the equipment damage or / and preventing the quality of the final part being compromised

Responsibilities

To operate CNC equipment to machine components for various industries such as automotive, medical, aerospace and others

To monitor and record quality data and to interpret statistical process control graphs. Maintain CNC equipment

Troubleshoot machining process

Locate and load the required NC programme as specified by the CNC Setter in the program run mode

Clamp the required part to be machined properly in the work holding and clamping fixture in the same way each time

Able to operate the machine effectively and according to safe working procedures using the specified machine control

Approach the part with reduced feed rate during first start-up of the day

Inform the Production team when any part of the machining process does not sound as before indicating bad part set up or tool wear on the cutting tool

Required Skills

Effectively communicate with clients and fellow employees both verbally and written in the English language

An individual must have the ability to write in a professional business manner to perform this job effectively

This position requires the ability to perform basic and complex geometric, algebraic, and trigonometric mathematical computations

It also requires the ability to apply concepts such as fractions, percentages, ratios and proportions to complex and practical situations

Ability to define problems, to collect data, to establish facts and to draw valid conclusions is necessary when performing this job

Individual should have excellent organizational, multitasking, and prioritizing skills

Communicate honestly and provide solutions to problems within a timely fashion

Able to work with minimal supervision, efficiently schedule and manage time Preferable knowledge working with DMG Mori high speed 5 axis machines such DMU 80 FD mill/turn, DMU 50 5 axis, DMU 60 Evo 5 axis, DMU 65 Monoblock Ultrasonic, CTX gamma 1250 TC turn/mill 5 axis and CTX Alpha 500 V6 with counter spindle option

5 axis machining experience a must

Siemens 840 D machine controls a must

Using 3D Touch probes of Renishaw type for part set up and part verification

Education : (UG - B.Tech/B.E. - Any Specialization) AND (PG- Any Postgraduate - Any Specialization, M.Tech - Any Specialization, Chemical, Electrical, Electronics/Telecommunication, Mechanical) AND (Doctorate- Any Doctorate - Any Specialization, Doctorate Not Required)

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Job Title : MOVCVD/ MBE Process development

Experience : Greater than 5 years

• Required to have minimum 5 years of experience in MOCVD/MBE of GaN/ III-V semiconductor
• Basic understanding of the semiconductor device fabrication processes
• Direct experience in GaN MOCVD, MBE process development, sustaining and characterization are added advantage. Lower experience can be considered in this case
• In-depth knowledge of optical/electron metrology principles
• Lead and drive multifunctional teams for tool start-up, tool acceptance and process development in start-up environment
• Clearly set goals and expectations for specific teams/groups/ owners to encourage specific actions in timely manner
• Highlight exceptions and provide alerts when problems occur, communicate progress and success to management as technical brief
• Develop/improve critical trend monitoring and use these inline trends to better predict the process, device and yield performance
• Basic understanding and strong trouble shooting skills of electrical and electronics issues
• Work closely with customers on the equipment and process related issues
• Self-driven, and ability to work independently individually or in a team environment
• Working with equipment, integration and device engineers to develop recommendations and prepare changes, additions, and modifications, which will improve the process quality
• In addition to the above experience the candidate needs to have general fab experience which includes
• a. Sound knowledge and experience with semiconductor wafer fabrication processes
• b. Basic understanding of MOSFET, HEMT, Diodes, Capacitors and CMOS devices and processes
• c. Sound understanding of characterization of MOCVD/MBE film
• d. Process characterization and optimization using DOE methodology.
• e. Ability to work effectively with customers & suppliers
• f. Good customer interface and communication skills
• g. Strong fundamental engineering knowledge and the ability to apply it
• h. Good process troubleshooting skills, in coordination with Integration, device and equipment team.
• i. Ability to learn quickly, in both process and Integration
• j. Experience or training in statistical process control (SPC) and related tools, software.
• k. The ability to work independently and in groups to resolve process and integration related problems
• l. A detailed understanding of semiconductor physics, applied chemistry, and processing requirements.
• m. Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed
• n. A willingness and ability to accept responsibility for project completion, project delegation and follow-up.
o. Ability to train others, ability to establish standard work-flow and operating instruction is highly preferred
p. Reliable candidate with integrity, work ethic and data driven-decision making is preferred
Education : (UG - B.Tech/B.E. - Any Specialization) AND (PG- Any Postgraduate - Any Specialization, M.Tech - Any Specialization, Chemical, Electrical, Electronics/Telecommunication, Mechanical) AND (Doctorate- Any Doctorate - Any Specialization, Doctorate Not Required)
As an MOCVD/MBE process Engineer, the candidate will support Fab start-up, tool acceptance, process development and process characterization in 4”/6”/8” fab
Candidate will understand, analyze, Improve, and suggest fix to process and integration issues that customer reports.
In addition, you will support the customer with experimentation, characterization and overall process development and improvement.
Candidate need to collect, document, and analyze data from metrology, equipment or projects conducted in fab, as well as monitor, analyze, and address SPC issues for the process on a daily basis
Candidate must be a motivated team player with good work ethic and time-management skills. Along with having ability to learn quickly, you are also expected to train other engineers. It is also essential you have the ability to work with minimal supervision and have strong communication and analytical problem-solving skills
Candidate must have the ability to keep fellow engineers motivated to work and complete the tasks in time.
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Job Title : Integration/ Device/ Process Development Engineer - Compound Semi-Conductor

Experience : Greater than 5 years or equivalent

• Installation of semiconductor tools at IC fab locations globally.
• Verification of functionality of all tool sub systems.
• Assessment of the tool for proper operation.
• Perform preventive maintenance as per schedules given by OEM/BKM.
• Perform tool calibrations as needed.
• Perform complex troubleshooting and repair efficiently to ensure the tool is available for manufacturing in the shortest possible time.
• Attention to detail, complete safety compliances and reporting.
• Document all the BKM, Lesson learnt for future reference.

Job Description

• Required to have minimum 5 years relevant experience in semiconductor wafer fabrication FAB with sound understanding of III-V device fabrication processes
• Direct experience in GaAs, GaN based LASERs, LED, Photodiode integration, GaN HEMT characterization and process development are added advantage. Lower experience can be considered in this case.
• Lead and drive multifunctional teams for process set-up and development in start-up environment
• Clearly set goals and expectations for specific teams/groups/ owners to encourage specific actions in timely manner
• Highlight exceptions and provide alerts when problems occur, communicate progress and success to management as technical brief
• Develop/improve critical trend monitoring (possibly using JMP journal/scripts to add tool/chamber level connect in the future) and use these inline trends to better predict the Device and yield performance
• Working with engineers to develop recommendations and prepare changes, additions, and modifications, which will improve the Device and product yield.

• In addition to the above experience the candidate needs to have general fab experience which includes .

• Intimate knowledge and experience with semiconductor wafer fabrication processes
• Sound understanding of MOSFET, LASERs, LEDs, Photodiode, Diodes, Capacitors and HEMT devices, process related electrical parameters and test.
• Device and Process characterization and optimization using DOE methodology.
• Ability to work effectively with customers & suppliers
• Good customer interface and communication skills
• Strong fundamental engineering knowledge and the ability to apply it
• Good Device/Integration troubleshooting skills, in coordination with process, test and equipment team.
• Ability to learn quickly, in both process, equipment and Device
• Experience or training in statistical process control (SPC) and related tools, software
• The ability to work independently and in groups to resolve Device, process and integration related problems
Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed
Willingness and ability to accept responsibility for project completion, project delegation and follow-up.
Ability to train others, ability to establish standard work-flow and operating instruction is highly preferred
Reliable candidate with integrity, work ethic and data driven-decision making is preferred
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Job Title : Semiconductor Photolithography Process Engineers

Job Description : ONLY CANDIDATES WITH INTERNATIONAL FAB EXPERIENCE WILL BE CONSIDERED

Experience : Minimum Industry Experience: 5 years

• Intimate knowledge and experience with semiconductor wafer fabrication processes and tools
• Process sustaining expertise in a wafer manufacturing environment
• Analysis of process deviations and troubleshooting in Production and implement the learning's for Yield improvement activities
• Process characterization and optimization using DOE methodology
• Strong fundamental engineering knowledge and the ability to apply it
• Good process troubleshooting skills, with the help of Integration, Device, equipment team
• Demonstrated ability to learn quickly, in both process and module.
• Experience or training in statistical process control (SPC) and related tools, software.
The ability to work independently and in groups to resolve equipment, process and integration related problems.
• A detailed understanding of semiconductor physics, applied chemistry, and processing requirements.
• Excellent written and oral communication skills
• Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed

Experience:

Specific:

Education:

• UG: B. Tech/B.E. - Any Specialization, Electrical, Electronics/Telecommunication, Mechanical.
• PG: Any Postgraduate - Any Specialization, M. Tech - Any Specialization, Electrical
• Electronics/Telecommunication, Mechanical, Metallurgy
• Doctorate: Any Doctorate - Any Specialization, Doctorate Not Required
As a Process Engineer, the candidate will support Fab operations by monitoring Semiconductor equipment and processes for both 200mm/300mm fabs. Candidate will understand, analyse, Improve, and fix process issues that customer reports. In addition, you will support the customer with testing, experimentation, and overall process development and improvement. Candidate need to collect, document, and analyse data from testing, experiments, or projects conducted in fab, as well as monitor, analyse, and address SPC issues for the process on a daily basis. Candidate will be required to transfer processes from R&D fabs to production fabs using a copy smart/exact method and help in sustainment of the process in the customer fabs
• Additional Requirements: Resume and/or cover letter must reflect each requirement above or it will be rejected.

Job Title : Integration/Yield Improvement Engineer

Job Description : ONLY CANDIDATES WITH INTERNATIONAL FAB EXPERIENCE WILL BE CONSIDERED

Experience : Minimum Industry Experience:5 - 10 years

• Required to have minimum 10 years relevant experience in semiconductor wafer fabrication plants with deep understanding of CMOS wafer fabrication processes. Candidate with Ph.D. can be considered even with 5 years of experience
• Respond to situations where first-line product support has failed to isolate or fix problems in malfunctioning equipment. Reports design, reliability and maintenance problems or bugs to design engineering
• Working with engineers to develop recommendations and prepare changes, additions, and modifications, which will improve the fabrication process and yield
• Lead and drive multifunctional teams for driving improvement in process
• Clearly set goals and expectations for specific teams/groups/ owners to encourage specific actions in timely manner
• Highlight exceptions and provide alerts when problems occur, communicate progress and success, and provide a common interface for inter-department works and collaboration for solving issues related to yield
• Automate and sustain yield report, covering critical yield matrixes and correlation of top bin failures for main/critical products with inline defect performances for the devices
• Enhance/develop/improve critical trend monitoring (possibly using JMP journal/scripts to add tool/chamber level connect in the future) and use these inline trends to better predict the yield performance
• Support additional analysis needs (systematic and automated ways), including Hi-Lo Yield concepts to inline controls. This work will enhance current yield modelling and prediction capability
• Prepare technical brief for management and customer, as needed

In addition to the above experience the candidate needs to have general fab experience which includes :

Education:

• UG: B. Tech/B.E. - Any Specialization, Electrical, Electronics/Telecommunication, Mechanical.
• PG: Any Postgraduate - Any Specialization, M. Tech - Any Specialization, Electrical
• Electronics/Telecommunication, Mechanical, Metallurgy
• Doctorate: Any Doctorate - Any Specialization, Doctorate Not Required
As a Process Engineer, the candidate will support Fab operations by monitoring Semiconductor equipment and processes for both 200mm/300mm fabs. Candidate will understand, analyse, Improve, and fix process issues that customer reports. In addition, you will support the customer with testing, experimentation, and overall process development and improvement. Candidate need to collect, document, and analyse data from testing, experiments, or projects conducted in fab, as well as monitor, analyse, and address SPC issues for the process on a daily basis. Candidate will be required to transfer processes from R&D fabs to production fabs using a copy smart/exact method and help in sustainment of the process in the customer fabs
• Additional Requirements: Resume and/or cover letter must reflect each requirement above or it will be rejected.

Job Title : Thin Film Equipment (PVD)

Experience : Must have at least 7 years of semiconductor tool experience in Thin film PVD tools

• Advanced troubleshooting skills on 200 AMAT PVD tools like Endura5500,ULVAC Entron200 & LAM INOVA
• LAM INOVA experience is most preferred
• Ownership of a defined owned toolsets, Plan & Publish tool recovery plans and maintain tool uptime
• Hands on experience in AMAT HP, VHP robots assembly and teaching
• Hands on experience on RF gen calibration
• Flexibility to work on shifts, over time, standby, on-call, holidays etc., when required
• Able to understand and service Vacuum technologies like Turbo & Cryogenic pumps, Helium leak check and Compressor maintenance
• Maintains chiller and heat-exchangers
• Responsible for all PM & CM activities, managing parts
• Manage and maintain cleaning cycle for process kits with proper inventory.
• Flexible to work on shifts, standby, on call, holidays etc on required
• Ability to understand customer process and assume responsibility for customer satisfaction
• Strong fundamental engineering knowledge and the ability to apply it
• Basic knowledge of Brooks and asyst smif.
• Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed. A willingness and ability to accept responsibility for project completion, project delegation and follow-up.

Education:

• UG: B. Tech/B.E. - Any Specialization, Electrical, Electronics/Telecommunication, Mechanical.
• PG: Any Postgraduate - Any Specialization, M. Tech - Any Specialization, Electrical
• Electronics/Telecommunication, Mechanical, Metallurgy
• Doctorate: Any Doctorate - Any Specialization, Doctorate Not Required
• As a Process Engineer, the candidate will support Fab operations by monitoring Semiconductor equipment and processes for 200mm fab line.
• Candidate will understand, analyses, Improve, and fix process issues that customer reports.
• In addition, you will support the customer with testing, experimentation, and overall process development and improvement.
• Candidate need to collect, document, and analyses data from testing, experiments, or projects conducted in fab, as well as monitor, analyses, and address SPC issues for the process on a daily basis.
• Candidate must be a motivated team player with good work ethic and time-management skills. Along with having ability to learn quickly, you are also expected to train other engineers. It is also essential you have the ability to work with minimal supervision and have strong communication and analytical problem-solving skills.