ORBIT Semiconductor Services

Job Openings

Job Title : Thin Film Equipment Engineer / Wet Etch / Rtp Rta

Experience : Minimum Industry Experience: 5 years

Installation of semiconductor tools at IC fab locations globally.
Verification of functionality of all tool sub systems.
Assessment of the tool for proper operation.
Perform preventive maintenance as per schedules given by OEM/BKM.
Perform tool calibrations as needed.
Perform complex troubleshooting and repair efficiently to ensure the tool is available for manufacturing in the shortest possible time.
Attention to detail, complete safety compliances and reporting.
Document all the BKM, Lesson learnt for future reference.

Requirements:

3years diploma or 4 years engineering in in any of the following-Chemical, Electrical, Electronics, Mechanical.
Required to have minimum 5 years relevant experience in semiconductor wafer fabrication/ Nano technology research fabrication. International wafer fabrication experience is mandatory.
Should be able to perform maintenance/calibration/ troubleshooting of semiconductor process/metrology equipment's.
Must have demonstrated working knowledge of advanced electro-mechanical systems operations and maintenance and be able to work with minimal or no assistance.
Adequate knowledge of basic electronic, pneumatics theory, principles of electrical circuits, motor control systems are needed.
Good team player with excellent written and verbal communication skills.
Attention to detail, complete safety compliances and reporting.
Experience in Vacuum Deposition tools, Sputter tools, RTP, Dry Etch tool & PECVD are must.
Knowledge of Vacuum pumps, RF generator, Chiller , heat exchanger maintenance are added advantage.

Job Title : Real Time Defect Analysis/ Yield Defect Density Engineer in Semiconductor industry

Experience : **ONLY CANDIDATES WITH INTERNATIONAL FAB EXPERIENCE WILL BE CONSIDERED**

Required to have minimum 5 years relevant experience in semiconductor wafer fabrication plants with deep understanding of CMOS wafer fabrication processes
Respond to situations where first-line product support has failed to isolate or fix problems in malfunctioning equipment. Reports design, reliability and maintenance problems or bugs to design engineering
Operate metrology tools to qualify process equipment and optimize processes, as well as improvements to existing products and processes
Create and optimize the recipes on KLA Surf scan/SP1, Patterned wafers inspection tools like KLA 2139 and SEM review tools like AMAT SEM vision
Working with engineers to develop recommendations and prepare changes, additions, and modifications, which will improve the fabrication process and yield
Sustain defect density monitors: minimize HOLD lot turnaround, improve wafer yield, identify the yield deterrents Lead and drive multifunctional teams for driving improvement in process
Clearly set goals and expectations for specific teams/groups/ owners to encourage specific actions in timely manner
exceptions and provide alerts when problems occur, communicate progress and success, and provide a common interface for inter-department works and collaboration for solving issues related to yield
Automate and sustain yield report, covering critical yield matrixes and correlation of top bin failures for main/critical products with inline defect performances for the devices
Enhance/develop/improve critical trend monitoring (possibly using JMP journal/scripts to add tool/chamber level connect in the future) and use these inline trends to better predict the yield performance
Support additional analysis needs (systematic and automated ways), including Hi-Lo Yield concepts to inline controls. This work will enhance current yield modelling and prediction capability

Prepare technical brief for MDs and directors, as needed

In addition to the above experience the candidate needs to have general fab experience which includes

Intimate knowledge and experience with semiconductor wafer fabrication processes

Analysis of process deviations and troubleshooting in Production and implement the learning's for Yield improvement activities.

Process characterization and optimization using DOE methodology.

DOE knowledge - Ability to design experiments that meet Design of Experiments standards.

Ability to work effectively with customers & suppliers

Good customer interface and communication skills

Strong fundamental engineering knowledge and the ability to apply it

Good process troubleshooting skills, in coordination with Integration, Device, equipment team.

Ability to learn quickly, in both process and module

Experience or training in statistical process control (SPC) and related tools, software

The ability to work independently and in groups to resolve equipment, process and integration related problems

A detailed understanding of semiconductor physics, applied chemistry, and processing requirements.

Knowledge of FEOL & BEOL process & integration is desirable

Having Knowledge of integration & device skill will be added advantage.

Excellent written and oral communication skills

Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed A willingness and ability to accept responsibility for project completion, project delegation and follow-up.

Innovative problem-solving skills and Strong multi-tasking skills

Ability to train others, ability to establish standard work-flow and operating instruction is highly preferred

Reliable candidate with integrity work ethic and data driven-decision making is preferred

Education : (UG - B.Tech/B.E. - Any Specialization) AND (PG- Any Postgraduate - Any Specialization, M.Tech - Any Specialization, Chemical, Electrical, Electronics/Telecommunication, Mechanical) AND (Doctorate- Any Doctorate - Any Specialization, Doctorate Not Required)

As a Process Engineer, the candidate will support Fab operations by monitoring Semiconductor equipment and processes for both 200mm/300mm fabs.

Candidate will understand, analyze, Improve, and fix process issues that customer reports.

In addition, you will support the customer with testing, experimentation, and overall process development and improvement.

Candidate need to collect, document, and analyze data from testing, experiments, or projects conducted in fab, as well as monitor, analyze, and address SPC issues for the process on a daily basis.

Candidate must be a motivated team player with good work ethic and time-management skills. Along with having ability to learn quickly, you are also expected to train other engineers. It is also essential you have the ability to work with minimal supervision and have strong communication and analytical problem-solving skills.

Candidate must have the ability to keep fellow engineers motivated to work and complete the tasks in time.

Job Title : ELCTRONICS_DESIGN_ENGINEER

Experience : Minimum Industry Experience: 2 to 6 years

Design and develop hardware, includes optimizing designs for manufacturability and cost efficiency
Capable to work on high power design
Will need to work in the multi-disciplinary team comprising electrical, software, system and process engineering
Previous exp. in designing Power boxes/ Electrical Modules
Rapidly generate design concepts that will develop into detail drawings to manufacture those concepts
Perform Failure Modes and Effects Analysis, Organize, participate and lead design reviews.
Familiar with PCB applications for control panel design and must have basic understanding PCB design and component selection
Selection of OEM Components and materials for power distribution box/ control panel design..
Work on EE CAD tools like circuit design/ simulation

*Mandatory Skills:

Able to design circuits with consideration of EMI and EMC standards
Detailed understanding of relevant design standards and compliances like NFC, NFPA, UL508, IEC standard, SEMI standard (Electrical)- exp. with UL Standards
Exp. with ERP and PLM (SAP/Team Center or similar systems

Job Title : CNC Operator

Experience : Greater than 8 years

A computer numerically controlled operator holds a highly specialised position found principally in production companies. They handle computer programmed machinery that perform a wide variety of functions such as drilling, cutting or shaping materials
Assessing suitability of material : Inspecting material and preparing for machining Knowledge of feature control frame, control symbols, and geometric tolerancing categories, characteristics and zone shapes ; Ability to cut blanks based on bar stock sizes. Knowledge of standard steel classification and numbering system

Planning machining taskspan Preparing job for running machining process Knowledge of machine selection and configuration, operation sequ encing, and workholding concepts and devices
Operating CNC machine Operating CNC machine to machine a precision part to the technical and QC specification Knowledge of machine controls and ability to deburr, fixture offset adjustment, geometry offset a djustment, setup and shutdown a machine, load parts, offset tool heights and adjust work shifts. Skills of drilling, facing, peripheral and pocket milling, reaming and tapping, etc

Measuring of tools and material Measurement of tools, material and workpieces using combination of suitable techniques and measurement instruments Knowledge of feature control frame, geometric control symbols and geometric tolerancing categories, characteristics; Ability to read micrometers, steel rule and Vernier scales. Prope r use of callipers , dial indicators, drop indicators, micrometers and steel rulers

Performing benchwork Perform Benchwork required at various stages of the CNC machining process. Ability to hack saw, to ream by hand Understanding thread classes and percentages, hand and power tapping

Applying corrective strategies during machining process Perform the material, part and machine related troubleshooting throughout the machining process to minimise risk of the equipment damage or / and preventing the quality of the final part being compromised

Responsibilities

To operate CNC equipment to machine components for various industries such as automotive, medical, aerospace and others
To monitor and record quality data and to interpret statistical process control graphs. Maintain CNC equipment
Troubleshoot machining process

Locate and load the required NC programme as specified by the CNC Setter in the program run mode

Clamp the required part to be machined properly in the work holding and clamping fixture in the same way each time

Able to operate the machine effectively and according to safe working procedures using the specified machine control

Approach the part with reduced feed rate during first start-up of the day

Inform the Production team when any part of the machining process does not sound as before indicating bad part set up or tool wear on the cutting tool

Required Skills

Effectively communicate with clients and fellow employees both verbally and written in the English language

An individual must have the ability to write in a professional business manner to perform this job effectively

This position requires the ability to perform basic and complex geometric, algebraic, and trigonometric mathematical computations

It also requires the ability to apply concepts such as fractions, percentages, ratios and proportions to complex and practical situations

Ability to define problems, to collect data, to establish facts and to draw valid conclusions is necessary when performing this job

Individual should have excellent organizational, multitasking, and prioritizing skills

Communicate honestly and provide solutions to problems within a timely fashion

Able to work with minimal supervision, efficiently schedule and manage time Preferable knowledge working with DMG Mori high speed 5 axis machines such DMU 80 FD mill/turn, DMU 50 5 axis, DMU 60 Evo 5 axis, DMU 65 Monoblock Ultrasonic, CTX gamma 1250 TC turn/mill 5 axis and CTX Alpha 500 V6 with counter spindle option

5 axis machining experience a must

Siemens 840 D machine controls a must

Using 3D Touch probes of Renishaw type for part set up and part verification

Job Title : MOVCVD/ MBE Process development

Experience : Greater than 5 years

Required to have minimum 5 years of experience in MOCVD/MBE of GaN/ III-V semiconductor
Basic understanding of the semiconductor device fabrication processes
Direct experience in GaN MOCVD, MBE process development, sustaining and characterization are added advantage. Lower experience can be considered in this case
In-depth knowledge of optical/electron metrology principles
Lead and drive multifunctional teams for tool start-up, tool acceptance and process development in start-up environment
Clearly set goals and expectations for specific teams/groups/ owners to encourage specific actions in timely manner
Highlight exceptions and provide alerts when problems occur, communicate progress and success to management as technical brief
Develop/improve critical trend monitoring and use these inline trends to better predict the process, device and yield performance
Basic understanding and strong trouble shooting skills of electrical and electronics issues
Work closely with customers on the equipment and process related issues
Self-driven, and ability to work independently individually or in a team environment
Working with equipment, integration and device engineers to develop recommendations and prepare changes, additions, and modifications, which will improve the process quality
In addition to the above experience the candidate needs to have general fab experience which includes
a. Sound knowledge and experience with semiconductor wafer fabrication processes
b. Basic understanding of MOSFET, HEMT, Diodes, Capacitors and CMOS devices and processes
c. Sound understanding of characterization of MOCVD/MBE film
d. Process characterization and optimization using DOE methodology.
e. Ability to work effectively with customers & suppliers
f. Good customer interface and communication skills
g. Strong fundamental engineering knowledge and the ability to apply it
h. Good process troubleshooting skills, in coordination with Integration, device and equipment team.
i. Ability to learn quickly, in both process and Integration
j. Experience or training in statistical process control (SPC) and related tools, software.
k. The ability to work independently and in groups to resolve process and integration related problems
l. A detailed understanding of semiconductor physics, applied chemistry, and processing requirements.
m. Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed
n. A willingness and ability to accept responsibility for project completion, project delegation and follow-up.

o. Ability to train others, ability to establish standard work-flow and operating instruction is highly preferred

p. Reliable candidate with integrity, work ethic and data driven-decision making is preferred

As an MOCVD/MBE process Engineer, the candidate will support Fab start-up, tool acceptance, process development and process characterization in 4”/6”/8” fab

Candidate will understand, analyze, Improve, and suggest fix to process and integration issues that customer reports.

In addition, you will support the customer with experimentation, characterization and overall process development and improvement.

Candidate need to collect, document, and analyze data from metrology, equipment or projects conducted in fab, as well as monitor, analyze, and address SPC issues for the process on a daily basis

Candidate must have the ability to keep fellow engineers motivated to work and complete the tasks in time.

Job Title : Integration/ Device/ Process Development Engineer - Compound Semi-Conductor Industry

Experience : Greater than 5 years or equivalent

Installation of semiconductor tools at IC fab locations globally.
Verification of functionality of all tool sub systems.
Assessment of the tool for proper operation.
Perform preventive maintenance as per schedules given by OEM/BKM.
Perform tool calibrations as needed.
Perform complex troubleshooting and repair efficiently to ensure the tool is available for manufacturing in the shortest possible time.
Attention to detail, complete safety compliances and reporting.
Document all the BKM, Lesson learnt for future reference.

Job Description

Required to have minimum 5 years relevant experience in semiconductor wafer fabrication FAB with sound understanding of III-V device fabrication processes
Direct experience in GaAs, GaN based LASERs, LED, Photodiode integration, GaN HEMT characterization and process development are added advantage. Lower experience can be considered in this case.
Lead and drive multifunctional teams for process set-up and development in start-up environment
Clearly set goals and expectations for specific teams/groups/ owners to encourage specific actions in timely manner
Highlight exceptions and provide alerts when problems occur, communicate progress and success to management as technical brief
Develop/improve critical trend monitoring (possibly using JMP journal/scripts to add tool/chamber level connect in the future) and use these inline trends to better predict the Device and yield performance
Working with engineers to develop recommendations and prepare changes, additions, and modifications, which will improve the Device and product yield.
In addition to the above experience the candidate needs to have general fab experience which includes .
Intimate knowledge and experience with semiconductor wafer fabrication processes
Sound understanding of MOSFET, LASERs, LEDs, Photodiode, Diodes, Capacitors and HEMT devices, process related electrical parameters and test.
Device and Process characterization and optimization using DOE methodology.
Ability to work effectively with customers & suppliers
Good customer interface and communication skills
Strong fundamental engineering knowledge and the ability to apply it
Good Device/Integration troubleshooting skills, in coordination with process, test and equipment team.
Ability to learn quickly, in both process, equipment and Device
Experience or training in statistical process control (SPC) and related tools, software
The ability to work independently and in groups to resolve Device, process and integration related problems
Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed
Willingness and ability to accept responsibility for project completion, project delegation and follow-up.
Ability to train others, ability to establish standard work-flow and operating instruction is highly preferred
Reliable candidate with integrity, work ethic and data driven-decision making is preferred